TCP820P Low Melting Point Thermal Conductive Phase Changing Material The TIC™820P series is low melting point thermal interface material. At 50℃, TIC....
Low Steady-State Thermal Resistance 7.5W/MK Thermal Conductive Phase Change Material For AI And 5G Devices Products description The TIC®800H Series is ...
Low Thermal Impedance 9.6W/MK Thermal Conductive Phase Change Material For Various Electrical Products Products description The TIC®800T Series is an ...
TIC800H-SP Superior reliable thermal performance Thermal Phase Change material For Power Conversion Equipment TIC®800H-SP Series is athermal phase ......
TIC800A Manufacture 2.5W Low Melting Point Thermal Interface Materials Thermal Phase Changing Material The TIC®800A series is a high-performance,cost....
TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling TIC®800G Series is a high-performance, cost-effective thermal ......