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TIS805-16-03 High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink

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TIS805-16-03 High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink

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Brand Name :Ziitek
Model Number :TIS805-16-03
Certification :UL and RoHs
Place of Origin :Vietnam
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :100000pcs/day
Delivery Time :3-5 work days
Packaging Details :24*13*12cm cartons
Products name :High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink
Application :Power Semiconductors
Thickness range(inch/mm) :0.009/0.229
Keywords :Thermally Conductive Insulator
Construction & Compostion :Ceramic Filled Silicone Elastomer / Polyimide Film
Thermal Conductivity :1.6W/mK
Continuous use temp :-60~180℃
Density :2.4g/cc
Color :Pink
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TIS805-16-03 High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink

The TIS®805-16-03 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insulating silicone base material to the heat-conducting material.

Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures

> Easy release construction
> Electrically isolating
> High durability


Applications:
> Car Battery & Power Supply

> Power semiconductors
> Audio and Video components

> Motor controllers

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

> Mass storage devices
> Automotive electronics
> Set top boxes

Typical Properties of TIS®805-16-03 Series
Property Value Test Method
Color Yellow Visual
Construction &Compostion Ceramic filled silicone elastomer /Polyimide Film ******
Thickness range 0.005inch (0.127mm) ASTM D374
Tensile Strength(MPa) 12 ASTM D412
Density 2.4 g/cc ASTM D297
Continuos Use Temp -60 to 180℃ ******
Breakdown Voltage(V/mm) 3000 ASTM D149
Dielectric Constant @ 1MHz 6.0 ASTM D150
Volume Resistivity 1.0X1012 Ohm-meter ASTM D257
Fire rating 94 V0 UL(E331100)
Thermal conductivity 1.6W/m-K ASTM D5470
Thermal impedance(℃-in²/W)@30psi 0.5 ASTM D5470

Standard Thicknesses

0.005inch (0.127mm)

Standard Sizes
12" x 160"(304mm x 48.76M)

The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.

TIS805-16-03 High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink

Packaging Details & Lead time

The packaging of Thermal Insulation Materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

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