CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

VIETNAM ZIITEK TECHNOLOGY CO.,LTD Vietnam Ziitek Technology Company Limited

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TIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

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TIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

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Brand Name :Ziitek
Model Number :TIS812-11-03
Certification :UL and RoHs
Place of Origin :Vietnam
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :100000pcs/day
Delivery Time :3-5 work days
Packaging Details :24*13*12cm cartons
Products name :Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance
Application :Car battery & electric
Keywords :Thermal Conductive Insulator
Construction & Compostion :Ceramic Filled Silicone Elastomer / Polyimide Film
Thermal Conductivity :0.9W/mK
Continuous use temp :-60~180℃
Density :2.4g/cc
Color :Gray
Thickness range(inch/mm) :0.009/0.229
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TIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

The TIS®812-11-03 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insulating silicone base material to the heat-conducting material.

Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures

> Easy release construction
> Electrically isolating
> High durability


Applications:
> Car Battery & Power Supply

> Power semiconductors
> Audio and Video components

> Motor controllers

> Display card
> Mainboard/mother board
> Notebook

> Power supply
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIS®812-11-03 Series
Property Value Test Method
Color Yellow Visual
Construction &Compostion Ceramic filled silicone elastomer /Polyimide Film ******
Thickness range 0.012inch (0.305mm) ASTM D374
Tensile Strength(MPa) 1.5 ASTM D412
Density 2.4 g/cc ASTM D297
Continuos Use Temp -60 to 180℃ ******
Breakdown Voltage(V/mm) 5000 ASTM D149
Dielectric Constant @ 1MHz 5.0 ASTM D150
Volume Resistivity 1.0X1012 Ohm-meter ASTM D257
Fire rating 94 V0 UL(E331100)
Thermal conductivity 1.1W/m-K ASTM D5470
Thermal impedance(℃-in²/W)@30psi 0.61 ASTM D5470

Standard Thicknesses

0.012inch (0.305mm)

Standard Sizes
12" x 160"(304mm x 48.76M)

The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.

TIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

Packaging Details & Lead time

The packaging of Thermal Insulation Materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Independent R&D team

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A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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