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X01 High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

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X01 High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

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Brand Name :Ziitek
Model Number :TS-Ziitek-Sharp Metal X01
Certification :UL & RoHS
Place of Origin :Vietnam
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :1000000 pcs/month
Delivery Time :3-6 work days
Packaging Details :24*13*12cm cartons
Products name :X01 High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
Keywords :Metal Phase Changing Materials
Density :8.0g/cm³
Applicatoin :Microprocessors Chipsets
Thermal conductivity :18.9W/mK
Feature :Good Thermal Conductive
Phase change softening temperature :40℃~250℃
Composition :Alloy
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High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

TS-Ziitek-Sharp Metal x01 is a new type of alloy phase changing heat conduction product made from a mixture of several metals, designed to solve heat dissipation and reliability problems.


TS-ZiiteK-Sharp Metal X01 is not easy to evaporate, safe and non-toxic, stable in physical and chemical properties, and has high thermal conductivity etc.When the phase change temperature is higher than its phase change temperature,the phase change material begins to softening and phase change, and can be filled to the tiny irregular contact surface of the device.Form a very small contact thermal resistance interface, to achieve good heat.

Features


>Good thermal conductivity
>Non-toxic and environmentally safe

>Excellent long term stability
>Ensure low thermal resistance.


Applications


>Microprocessors

>Chipsets

>Graphic processing chips

>Set Top Box
>LED

Typical Properties of TS-Ziitek-Sharp Metal X01 Series
Property Value Test Method
Color Silvery white Visual
Composition Alloy ****
Density (g/cm³) 8.0 ASTM D792 @25℃
7.9 ASTM D792 @80℃
Thermal conductivity(W/mK) 18.9 ISO22007-2.2 @25℃
15.3 ISO22007-2.2 @80℃
Specific heat capacity(J/g℃) 0.24 ASTM E1269@25℃
0.26 ASTM E1269@80℃
Resistivity (Ω-m) <10-7 ASTM D257
Continuous Use Temp(℃) -45 to 250℃ Ziitek Test Method
Phase Change Temperature Range(℃) >60 ASTM D3418
Solidification Range(℃) <57 ASTM D3418

Storage Method
Recommended storage in a warehouse environment at 18-30°C, with maximum humidity notexceeding 70%.


Usage lnstructions
Avoid contact with aluminum or metal surfaces.
After applying X01, use a compatible thermal pad or foam to enclose and secure the area along the edges of the liquid metal, ensuring it remains contained without leaking or spreading.

X01 High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

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