CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
VIETNAM ZIITEK TECHNOLOGY CO.,LTD Vietnam Ziitek Technology Company Limited
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Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive
TIS™580-20 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.
TIS™580-20 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.
TIS™580-20 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
Feature
> Good thermal conductivity: 2.0W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Application
| Typical values of TISTM580-20 | ||
| Appearance | White paste | Test Method |
| Density(g/cm3,25℃) | 1.6 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7 | ***** |
| Elongation(%) | ≥200 | ASTM D412 |
| Hardness(Shore A) | 45 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.5 | ASTM D1876 |
| Peel Strength(N/mm) | ＞5 | ASTM D1876 |
| Operation temperature(℃) | -60～250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 2.0 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.