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TIF100-60-11F Thermal Silicone Pad For Heat Sink Cooling
Ziitek TIF™100-60-11F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features:
> Good thermal conductive: 6.0W/mK
> Good thermal conductivity
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness
Applications:
> Semiconductor automated test equipment (ATE)
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
Typical Properties of TIF100-60-11F Series | ||
Property | Value | Test method |
Color | Gray | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Density | 3.25g/cc | ASTM D297 |
Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
Hardness | 60 Shore 00 | ASTM 2240 |
Continuos Use Temp | -40 to 160℃ | ****** |
Dielectric Breakdown Voltage | 10.0K VAC | ASTM D149 |
Dielectric Constant | 6.0 MHz | ASTM D150 |
Volume Resistivity(Ohm-cm) | 5.2X10¹³ | ASTM D257 |
Fire rating | 94 V0 | UL E331100 |
Thermal conductivity | 6.0W/m-K | ASTM D5470 |
Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)
Products Size:
8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.
Vietnam Ziitek Technology Company Limited is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
FAQ
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.